ROADLINK INFRATECH PRIVATE LIMITED
9845008F752E1A97FE15
ISSUED
Company data
| Legal name | ROADLINK INFRATECH PRIVATE LIMITED |
| Legal address | P. No. 87, 3rd Floor, Tagore Nagar DCM, Ajmer Road, Jaipur, 302006, India |
| Registration authority entity ID | U45309RJ2017PTC057341 |
| Entity status |
Active
|
LEI registration details
| LEI code | 9845008F752E1A97FE15 |
| Status |
ISSUED
|
| Automatic renewal until | 2028-03-05 |
| Next renewal date | 2026-03-05 |
| Managing LOU | Ubisecure Oy |
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ROADLINK INFRATECH PRIVATE LIMITED
LEI: 9845008F752E1A97FE15
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Company data
| Legal name | ROADLINK INFRATECH PRIVATE LIMITED |
| Entity status |
Active
|
| Registered at |
Companies Register
(Ministry of Corporate Affairs)
India RA000394 |
| Registration authority entity ID | U45309RJ2017PTC057341 |
| Entity category | GENERAL |
| Entity legal form code | Private Limited Company (en) YSP9 |
| Entity created at | 2017-03-01 |
| Validated At |
Companies Register
(Ministry of Corporate Affairs)
India
RA000394
|
| Validated As | U45309RJ2017PTC057341 |
LEI registration details
| LEI code | 9845008F752E1A97FE15 |
| Status |
ISSUED
|
| Initial registration | 2024-03-05 |
| Last update | 2025-03-03 |
| Automatic renewal until | 2028-03-05 |
| Next renewal date | 2026-03-05 |
| Managing LOU | Ubisecure Oy |
| Validation sources | FULLY_CORROBORATED |
Legal address
| Legal address | P. No. 87, 3rd Floor, Tagore Nagar DCM, Ajmer Road |
| Postal code | 302006 |
| City | Jaipur |
| Region code | IN-RJ |
| Country | IN | India |
Headquarters address
| Headquarters address | P. No. 87, 3rd Floor, Tagore Nagar DCM, Ajmer Road |
| Postal code | 302006 |
| City | Jaipur |
| Region code | IN-RJ |
| Country | IN | India |
Parents
|
No parent data available
|
Children
Direct children
Ultimate children
|
No direct child data available |
|
No ultimate child data available |
ROADLINK INFRATECH PRIVATE LIMITED
LEI: 9845008F752E1A97FE15
LEI registration status: ISSUED
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ROADLINK INFRATECH PRIVATE LIMITED
LEI: 9845008F752E1A97FE15
LEI registration status: ISSUED
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