FGP Corporate Plus Bond Fund
copy
5493004WYHUNB3ZH1X02
5493004WYHUNB3ZH1X02
issued
Company data
| Legal name | FGP Corporate Plus Bond Fund |
| Legal address | 1 Adelaide Street East Suite 2600, Toronto, M5C 2V9, Canada |
| Registration authority entity ID | 00046967 |
| Entity status |
Active
|
LEI registration details
| LEI code | 5493004WYHUNB3ZH1X02 copy 5493004WYHUNB3ZH1X02 |
| Status |
Issued
|
| Next renewal date | 2026-05-01 |
| Managing LOU | EQS Group AG |
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Company data
| Legal name | FGP Corporate Plus Bond Fund |
| Entity status |
Active
|
| Registered at | System for Electronic Document Analysis and Retrieval (SEDAR) (Canadian Securities Administrators) Canada, Canada RA000830 |
| Registration authority entity ID | 00046967 |
| Legal jurisdiction | CA |
| Entity category | FUND |
| Entity legal form code | 8888 |
| Entity created at | 2013-01-14 |
| Validated At | System for Electronic Document Analysis and Retrieval (SEDAR) (Canadian Securities Administrators) Canada, Canada RA000830 |
| Validated As | 00046967 |
LEI registration details
| LEI code | 5493004WYHUNB3ZH1X02 copy 5493004WYHUNB3ZH1X02 |
| Status |
Issued
|
| Initial registration | 2022-05-03 |
| Last update | 2025-04-04 |
| Next renewal date | 2026-05-01 |
| Managing LOU | EQS Group AG |
| Validation sources | FULLY_CORROBORATED |
Legal address
| Legal address | 1 Adelaide Street East Suite 2600 |
| Postal code | M5C 2V9 |
| City | Toronto |
| Region code | CA-ON |
| Country | CA | Canada |
Headquarters address
| Headquarters address | 1 Adelaide Street East Suite 2600, c/o FOYSTON, GORDON & PAYNE INC. |
| Postal code | M5C 2V9 |
| City | Toronto |
| Region code | CA-ON |
| Country | CA | Canada |
Parents
|
NON_CONSOLIDATING (Direct parent exception reported) NON_CONSOLIDATING (Ultimate parent exception reported) |
Children
Direct children
Ultimate children
|
No direct child data available |
|
No ultimate child data available |
Fund Manager
FGP Corporate Plus Bond Fund
LEI: 5493004WYHUNB3ZH1X02
LEI registration status: ISSUED
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FGP Corporate Plus Bond Fund
LEI: 5493004WYHUNB3ZH1X02
LEI registration status: ISSUED
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